High-Frequency/High-Speed Vacuum Micro-Nano-Electronic Devices And Technologies

高频/高速真空微纳电子器件与技术

This field aims to develop an alternative roadmap for next-generation electronic devices and systems by leveraging vacuum as the transport medium for electrons and engineering at micro- and nanoscales. In a vacuum, electrons travel ballistically (without scattering), enabling near-light-speed transport and eliminating inherent solid-state limitations like electron-phonon scattering, bandgap constraints, and junction heating. This allows for overcoming the fundamental limitations of solid-state semiconductors and achieving unprecedented performance in high-frequency (GHz-THz) and high-speed (picosecond or faster switching) operation, particularly at extreme harsh environments (e.g., high temperature ranging from RT to ~400 ℃ and high-energy radiation). Combining with the development of advanced micro-nano-fabricating technologies, ultra-scaled on-chip integrated nano-vacuum devices and systems have been appeared with drastically reduced operating voltage and ultrafast terahertz operation. The field sits at the intersection of vacuum electronics, solid-state micro/nanofabrication, quantum emission physics, and RF/microwave engineering. This field promises to fill the critical "THz gap" , overcome the longstanding “energy-time limit”, and push the frontiers of speed, power, and frequency where conventional semiconductors struggle, potentially revolutionizing the development of next-generation electronics.

Topics:
1. High-frequency vacuum electronic devices and technologies
2. Micro-nano-vacuum devices and fabrications
3. Nanoscale air-channel electronic devices and technologies
4. Ultra-fast switching devices and technologies
5. Field-emission cold cathodes: Field emission physics and materials
6. Electron source, Ion source, or Terahertz source
7. 5G/6G Communications
8. On-chip integrated vacuum devices
9. Advanced vacuum integrated circuit
10.Radiation-resistant vacuum micro-nano-electronics

ICET 2026 will take place at Chengdu, China, from May 29-31, 2026. This key electronics event should be a "must attend" on your conference calendar.

Call for Papers Timeline / 征稿时间

Oragnizing Chair

Dr. Nannan Li, Institute of Electronic Engineering, CAEP Nannan Li, Female, Doctor/Associate Researcher, graduated in Physical Electronics from UESTC, and now works at Institute of Electronics, Chinese Academy of Engineering Physics. She has long been committed to the research of vacuum micro-nano electronics and novel micro-nano fabricating technology. Over the past five years, she has presided over five national natural science foundation projects and one project of the Science and Technology Department of Sichuan Province. She has published a number of representative papers in high-level SCI journals such as Adv. Mater., Susmat, JMCC, ACS Appl. Nano Mater., IEEE Trans. Electron Dev., and Advanced Materials Technologies, and has applied for several national invention patents.