Flexible Sensing and Circuits – Science for an Intelligent World / 柔性传感与电路-迈向智能世界的科学

The development of artificial intelligence relies heavily on sensors for information acquisition. Currently, various types of sensors are widely applied in fields such as robotics, intelligent manufacturing, autonomous driving, and health monitoring, and are evolving towards smarter, smaller, multi-modal, and integrated designs. However, traditional rigid sensors struggle to closely adhere to complex surfaces, making it difficult to undergo deformation in response to movement, which severely affects the effective acquisition of signals in complex working environments. In contrast to rigid sensors, flexible sensors have advantages in flexibility, shape adaptability, miniaturization, and biocompatibility, facilitating efficient integration of information between humans, objects, and the environment. Moreover, the practical application of flexible sensing technology depends on the overall development of flexible system-on-chip (SoC) circuits, which include sensing, processing, and communication systems, in order to truly serve the era of artificial intelligence. This special session aims to promote the latest research on flexible sensing and circuits in areas such as sensing materials, identification mechanisms, multi-modal fusion, and large-scale integration, and to explore effective strategies for promoting the large-scale market application of flexible sensing technologies in key technical fields.
人工智能的发展离不开传感器获取信息。目前，各种类型的传感器已广泛应用在机器人、智能制造、无人驾驶和健康监测等领域，并朝着智能化、小型化、多模态化和集成化方向发展。然而，传统的刚性传感器难以与复杂的物体表面实现紧密贴合，无法随运动产生相应的形变，从而严重影响了复杂工作环境下对待测信号的有效采集。与刚性传感器相比，柔性传感器在柔韧性、形状适应性、微缩性和生物相容性等方面具有优势，有助于实现信息与人、物体和环境的高效共融。此外，柔性传感技术的实际应用还必须依赖于柔性集成电路SoC（包括传感、处理和通信系统）的整体发展，从而真正服务于人工智能时代。本次专题会议旨在推动柔性传感与电路在传感材料、多模融合和大规模集成制造等方面的最新研究，并探讨促进柔性传感技术在关键技术领域大规模市场化应用的有效策略。

Topics:
1. Flexible Sensing Material Design and Fabrication / 柔性传感材料设计与制造
2. Flexible Structure and Device Design / 柔性结构与器件设计
3. Flexible Bioelectronics and Healthcare / 柔性生物电子与健康医疗
4. Flexible Energy Electronics Technology / 柔性能源电子技术
5. Electronic Skin for Smart Robotics / 智能机器人电子皮肤
6. Flexible Neumorphic Devices and Systems / 柔性神经形态器件与系统
7. Emerging Sensor Technologies and Applications / 新兴传感器技术与应用
8. Wearable Sensors and Systems / 可穿戴传感器与系统
9. Flexible Electronics Scalable Manufacturing / 柔性电子可扩展制造
10. Flexible Device-Circuit Interaction and Compensation / 柔性器件-电路交互与补偿
11. Flexible Electronics Integration and Manufacturing Technologies / 柔性电子集成制造技术

ICET 2025 will take place at Chengdu, China, from May 17-20, 2025. This key electronics event should be a "must attend" on your conference calendar.

Call for Papers Timeline / 征稿时间

• Submission Deadline: March 20th, 2025
  全文截稿时间：2025年03月20日
  
• Notification Date: April 15th, 2025
  录用通知时间：2025年04月15日
  
• Registration Deadline: Apeil 25th, 2025
  注册截止时间：2025年04月25日
  

Oragnizing Chairs

Prof. Dr. Yang Li, Shandong University Dr. Yang Li, Full professor of Shandong University, doctoral supervisor, IEEE senior member, Chinese and Korean Young Scientist of Ministry of Science and Technology, young expert of Shandong Taishan Scholar, leader of Shandong Province Integrated Circuit Innovation Team, winner of Shandong Province Outstanding Youth Fund, selected of Shandong Province Young Science and Technology Talent Promotion Project, Qilu Young Scholar. He has been engaged in flexible electronics and new information device research for longterm. He has presided over 15 key projects above provincial and ministerial level, such as National Natural Science Foundation projects, Ministry of Science and Technology projects, Major basic research projects of Shandong Province, Outstanding Youth Fund projects of Shandong Province, and key research and development programs of Shandong Province. As the first author/corresponding author, he has published more than 60 articles in top journals in the field, such as Chem. Soc. Rev., Matter, Adv. Mater., Adv. Funct. Mater., Adv. Sci., IEEE Trans. Electron.Dev., including 10 cover papers, 5 ESI highly cited papers, and 2 hot papers. He has obtained 15 Chinese national invention patents (5 achievements have been transformed), 11 South Korean invention patents, and co-authored 1 English academic book. His representative achievements have produced important academic influence and have been highly valued by famous scholars all over the world, including academicians of the Chinese Academy of Sciences, President of the European Academy of Sciences, academicians of the American Academy of Sciences, academicians of the American Academy of Engineering, IEEE fellows, Argonne National Laboratory, Sandia National Laboratory, University of Pennsylvania, Tsinghua University, Peking University and so on.

Qikai Guo Shandong University	Xinming Zhuang Shandong University	Hongsen Niu Jinan University