Integrated Circuit / 集成电路

The Integrated Circuit  offers participants from the academia, electric utilities and industry to discuss the field of theory, design, and implementation of integrated circuits and systems, in compound semiconductor integrated circuits, embracing GaAs, InP, GaN, SiGe, as well as nanoscale CMOS technology. Coverage includes all aspects of the technology from materials issues, device fabrication and modeling through IC design and testing, high volume manufacturing, and system applications.

ICET 2019/IC will take place at Chengdu, China, from May 10-13, 2019. This key electronics event should be a "must attend" on your conference calendar.

Call for Papers Timeline / 征稿时间

  • Abstract Submission Deadline: Dec. 1st, 2018
    摘要截稿时间:2018年12月01日
  • Paper Submission Deadline: Dec. 5th, 2018
    全文截稿时间:2018年12月05日
  • Notification of Acceptance: Dec. 25th, 2018
    录用通知时间:2018年12月25日

Call for Papers / 征稿主题

Track 4: Integrated Circuit / 集成电路

Download the call for papers as pdf >>

Topics

  • Innovative device concepts in emerging technologies
    This includes but is not limited to biomedical SOCs, sensors and MEMS, hardware based machine learning, emerging memories, silicon photonics, disruptive digital design, large area electronics, implementations in non-CMOS and hybrid process technologies, GaAs, InP, GaN, SiGe.
  • Analog, RF, mixed-signal, mm-wave, THz circuit
  • blocks and ICs in III-V, CMOS, and SiGe BiCMOS
  • Optoelectronic and photonic devices and OEICs
  • Device and circuit modeling / EM and EDA tools
  • Thermal simulation and advanced packaging of high-power devices and ICs
  • Device and IC manufacturing processes, testing methodologies, and reliability
  • Power Management circuits and techniques for power generation, conversion
  • Wireless Transceiver and RF Circuits
  • Wireline Communications Circuits and Systems
 

ICET 2018/ Integrated Circuit Chairs

  • Prof. Gene Eu Jan, National Taipei University, Taiwan
  • TBD